Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
Features:
- 3D SPI
- Laser Line Scan Method
- Fastest Inspection Speed in the Industry
- Real 3D Image
- Inspection Irrelevant to Color, Material, Surface Roughness
- Automated Measurement of PCB Warpage
- Automated Compensation of PCB Stretch and Shrinkage
- Process Optimization with Feedback & Feedforward Linkage Support
- Inspection Items
Height, Area, Volume, Offset, Bridge, Shape, PCB Warpage, PCB Shrink, etc.
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